Caliber Interconnect solutions is one of the leading providers of test services for semiconductor ICs with a myriad of end-use applications such as: Computing,Communication, Consumer, Automotive , Security, Industrial and Medical. Our experience working across multiple industries & markets has enabled us to develop world class processes to aid in rapid bring up reducing time to market and costs. We offer a wide range of services under one roof to provide customers with the full-turnkey manufacturing solutions including: ATE Interface, Wafer Sorting, Packaging Solutions, Test Engineering Solutions, Post Production Support etc,. Additionally, we have long established relationships with service partners across strategic locations in the world including Taiwan, Vietnam & China to enhance our value offerings and provide seamless support to customers needing which include Bump, FAN-In and FAN-Out WLCSP, 3D Embedded Substrate Manufacturing and Burn-In.
Embedded Product Engineering
Caliber Embedded engineers with our technology innovation and unique combination of expertise in Embedded Hardware, Embedded Software, PCB design and mechanical design, provide end-to-end product engineering solutions from product design to production for leading product companies, service providers and aspiring start-ups.
Our product engineering team is led by high Caliber engineering professionals experienced in Embedded Product design having decades of hands on experience in delivering multiple products to the global market. With our Customer Focus and in-depth understanding of technology, We strive hard continuously to shorten the design cycle so that our customers address the window of opportunity ahead of competition. This is backed by our efficient use of tools, matured process and systems. We are specialized in providing Product Engineering Solutions to IOT and Wearable Devices, Railways and Industrial Products, Automotive and Energy Solutions.
Caliber offers IC package design services for package design technologies such as flip-chip, wire-bond, stacked-die, System-in-Package (SiP), Package-on-package (PoP), Package-in-Package (PiP), and Chip-scale-package (CSP). We also offer other vertical space transformers (MLO/MLC) meant for ATE testing applications. We offer package solutions for ICs of high-speed digital, mixed-signal and RF products. Package design has become very complex with ever increasing data - rates and shrinking IC fabrication process technology. This requires a high degree of expertise and careful signal integrity & power integrity analysis.
Interconnects operating at high frequency and fast switching rates demand rigorous SI analysis so the design is right at the first time. Caliber Interconnect's SI engineers bring strong knowledge in SI theory and expertise in simulation tools to analyze various SI/PI issues like reflection due to impedance mismatch, crosstalk, signal attenuation and PDN noise.The analysis is carried out in pre and post layout analysis. Planning the stack-up for controlled impedance, dielectric material selection for high frequency operation, I/O buffer selection for different drive strengths, topology optimization, termination strategy, routing specifications(trace width, spacing and length matching) and floor planning for critical components are various sections in pre-layout analysis.
HDI Interconnect Design
Caliber delivers high quality Printed Circuit Board design services for the given schematic and design inputs with a short cycle time at a competitive cost. Our end-to-end solution driven design approach resolves issues encountered in designing high speed PCB of high clock speeds. Our experienced board designers having extensive knowledge to provide solution for transmission line effect, EMI and Crosstalk. The HDI design team is supported by a team of electrical simulation specialists who ensures that the design overcomes all critical signal issues to function effectively. We have long term relationship with selected group of PCB fab and assembly house to support your prototype and volume requirements.
We are a Product Engineering Company with a proven track record of offering Integrated product engineering solutions for major global players of diverse industries like Semiconductor, Avionics, Railways, Industrial, IOT (Internet of Things).