ASIC Design
From RTL Netlist to GDSII: Engineering Tomorrow's Technology, Today!
Services Synopsis
At HDI Design, we’re experts in electrical simulation, ensuring your designs conquer signal challenges and excel in efficiency. Our trusted PCB fab and assembly partnerships offer unparalleled support for prototypes to volume production. Specializing in RF and mixed signal layouts, combined with thermal and signal integrity expertise, we provide comprehensive solutions for your PCB design needs.
We take full accountability for the complete board development cycle, from schematic development to delivering fully tested and certified assembled boards (PCA – Printed Circuit Assembly). Our expertise lies in handling tightly constrained, highly complex circuit boards for military applications, avionics, and processor motherboards, making us the ideal partner for those seeking to develop advanced, cutting-edge technology.
System level boards
Reliable Processes
Our experts have perfected a dependable design and signal routing process, ensuring the prompt delivery of accurate designs with superior quality achieved right from the outset.
Interface Expertise
Designed versatile interfaces including 112 GigaByte Ethernet, com serdes, PCIe Gen5, LPDDR5, GDDR, MIPI Cphy, HDMI, USB, LVDS and so on. Ensured performance through simulation prior to prototype fabrication.
Technology advantage
We collaborate with top-tier PCB/Substrate manufacturers worldwide. Designed 110 layers (max count) PCB for memory testing. Engineered high density boards (HDI) with maximum 13 buildup layers on either side.
Mixed signal designs
Circuit designs that seamlessly combine analog and digital components to process both continuous and discrete signals effectively.
High voltage and high current designs
Circuit designs that seamlessly combine analog and digital components to process both continuous and discrete signals effectively.
About
// HDI & ATE PCB Designs
Our Skills and Expertise
Our company takes pride in being an IPC member and having IPC certified designers. We have an extensive collection of footprint libraries that are compliant with both IEEE and IPC standards. Additionally, we have a dedicated engineering team that focuses solely on PCB layout verification and SI analysis. Our in-house software team extends the capabilities of our EDA tools by customizing scripts and automation tools. With the ability to scale up in a short time frame, we offer fast and quick turn designs. It is our responsibility to ensure that our products pass the EMI/EMC, vibration, and drop test qualification processes for product certification.
We possess technical expertise in a diverse range of technologies, including High Definition Multimedia Interface (HDMI), Versa Module Europa (VME), Low Voltage Differential Signaling (LVDS), Reduced Voltage Differential Signaling (RVDS), High-speed Universal Serial Bus (USB), Serial Peripheral Interface 4 (SPI-4), Rambus Dynamic Random-Access Memory (RDRAM), Serial Advanced Technology Attachment (SATA), Rapid Input/Output (IO), High-speed Serializer/Deserializer (SERDES), Double Data Rate 2/3/4 (DDR2/3/4), Quad Data Rate-Synchronous Random Access Memory (QDR-SRAM), Ethernet Physical Layer (PHY), Peripheral Component Interconnect (PCI), Peripheral Component Interconnect Express (PCI-e), and Backplane connectors with speeds up to 30 Gbps.
As experienced PCB designers, we possess a wide range of expertise in designing high-speed digital, RF, and mixed-signal circuits. Our design capabilities extend to high-speed backplane PCBs, controlled impedance boards, and precision analog/mixed-signal boards with controlled delay matching. In addition, we have extensive knowledge and experience in RF and microwave design, as well as microvia design, constraint-driven placement, and routing.
Our designs always adhere to IPC/MIL standards, and we specialize in creating high-speed PCBs that involve multi-gigabit series. We are adept at designing low power consuming boards that utilize power management techniques and meet ROHS compliance requirements.
Furthermore, we have extensive experience in HDI layout designs with micro vias, high-speed multilayer PCBs with BGA and FBGA designs, and flexible PCB design (FPCB). Our expertise and commitment to quality enable us to deliver exceptional results to our clients.
Our PCB Library Management service supports the development and maintenance of component libraries according to the IPC 7351B standards. In addition, customer specifications can be incorporated alongside the IPC standards, depending on the requirements. The service also provides an enhanced padstack naming convention that allows for unique and simple identification of pads. Symbol library creation and component footprint creation and maintenance for multiple EDA tools are also available. The service can accommodate organization-specific standards as needed. The dedicated library team ensures that new component library requirements have zero defects in their footprints. The service also offers 3D modeling of components in multiple CAD tools and can develop libraries under all EDA tools.
Highlights
Experience with FinFET, CMOS, BCD and SOI
Technology experience on varying process nodes optimized for performance, power ranging from 28nm, 16nm, 10nm and 7nm
Collaboration with top-tier semiconductor fab houses
Multiple full chips and IP level tape out have been done successfully with first-pass silicon
ASIC Design
From RTL Netlist to GDSII: Engineering Tomorrow's Technology, Today!
Expertise
We spearhead the chip development process, laying the groundwork for the flawless execution of intricate semiconductor devices
- The placement and interconnection of functional blocks are precisely defined to ensure optimal performance within the available space
- Chip architectures are crafted by our team to balance desired functionality with minimal power consumption and footprint
- Strategic planning is applied to the chip architecture, prioritizing efficient power utilization, achieving desired performance targets and minimizing the overall chip area
Caliber provides RTL design services for IP and SOC development, starting from product specifications.
- Expertise in IP block Design and Development
- Proficiency across multiple sectors including automotive, networking, mobile, IoT, microprocessors, multimedia and cloud computing
- Track record in designing protocols like I2C, SPI, AMBA-AXI, AMBA-AHB, UVM, WISHBONE and UART model
- Extensively worked on IPs like high-speed interfaces, memory controllers, video codecs, networking, USB and PCIe
- Leading front-end tools (Synopsys, Cadence, Mentor) are leveraged for Lint, CDC, Low Power and Synthesis
We offer end-to-end design verification services, encompassing the full architecture, development of new test benches, transaction-level models, scoreboards and thorough coverage analysis.
- Exposure in verification methodologies like OVM, UVM and VMM
- SoC Verification
- Coverage and Formal Verification
- Power-aware verification
- VIP development
- VIP Integration
- Gate Level simulations
- Environment Architecture Development
RTL synthesis – (Logical and Physical Aware Synthesis) acts as the critical bridge between the high-level design concept and its physical realization in silicon.
- Transformation of RTL description to gate-level representation
- Management of area, power and timing
- Bridging high-level design with silicon implementation in the ASIC design flow
- Optimization techniques for technology mapping and logic restructuring
To develop and execute a comprehensive DFT strategy, enhancing IC testability in the post-silicon phase for seamless first-pass silicon.
- DFT architecture and scan methodology
- DFT (JTAG, SCAN, MBIST) insertion and verification
- ATPG pattern generation and Timing simulation
- Test coverage analysis and improvement
- DFT DRC checks and fixes
- Extensive support on DFT insertion and Simulations
- Deep support in industry standard tool sets
Our physical design team excels in the RTL-to-GDSII flow, emphasizing PPA optimization for advanced technology nodes and processes.
- Our extensive portfolio spans projects across diverse sectors, including Networking, Mobility, Automotive, Processor and Telecom designs. Through meticulous optimization of critical paths, innovative timing closure techniques and architectural advancements, we produce designs distinguished by their speed, throughput and responsiveness
- Our capabilities encompass the latest silicon processes, from 180nm down to 28nm, 14nm and leading-edge 7nm nodes
- Delivered turnkey solutions for SoCs and ASICs digital design, overseeing the entire process from specifications to silicon bring-up
- Achieving timing closure for high-frequency designs utilizing cutting-edge technology down to 7nm
- Creating timing specifications and comprehensive check lists for development purposes
- Comprehensive low-power design and test methodologies
