IC Package Design
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Test Home
  • IC package design services flip-chip, wire-bond, stacked-die, System-in-Package (SiP), Package-on-Package (PoP), Package-in-Package (PiP), Chip-Scale-Package (CSP) 
  • Vertical space transformers (MLO/MLC) for ATE testing applications. high - speed digital ICs, mixed-signal ICs and RFIC products
  • High degree of expertise and careful signal integrity & power integrity analysis
  • Strong capability to perform simultaneous - switching - noise (SSN) SI/PI simulations, parasitic package extractions
  • System - level SI timing analysis and Power integrity optimization using the latest Ansys
  • Cadence sigrity tools
  • Thermal and mechanical aspect of package design
  • Flip-Chip, BGA, Wire-bond BGA, Chip-Scale-Package (CSP), Package-on-Package (PoP), Package-in-Package (PiP) design, MLO/MLC package for ATE hardware
  • System-in-Package (SiP) design for applications such as cellular, bluetooth, WLAN, GPS, camera, PDA and CMOS sensor
  • Signal Integrity & Power Integrity analysis & optimization during early stage of package design
  • IC/Package/Board co - design flow
  • SSN analysis based on SI/PI, co - design flow using the SPICE netlist
  • Package RLC extraction & package model generation for SI/PI analysis
  • Power Integrity and decoupling cap optimization
  • Design tools – Mentor and Allegro package designer
  • Thermal & mechanical design
  • Coordination with assembly-house and substrate foundry to achieve the first- time right substrate
  • Strict adherence to assembly specifications
  • Experienced CAM team validates the design for fab house DFM specification
Leading Provider Of High Speed Design And Analysis Services For:
  • Probe cards
  • System in packages (SiP)
  • Multi-layer package designing and layouts
  • Multi chip modules (MCMs)
  • MLO/MLC substrate designs
Highly Skilled Design/Analysis And Layout Team
  • More than 800+ package designs successfully completed
  • Organic build up from 1-2-1 to 8-2-8 layers
  • Low cost 4 layers laminates
  • Multi layer ceramic designs
Cost-Effective And Timely Job Completion

Lead Time 1.5 to 3 weeks from frozen netlist based on complexity.

Advanced Tools
  • SIP4150SPB - Allegro (R) package designer plus
  • SIP226SPB   - APD SiP layout option
IC Package Design

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We are a Product Engineering Company with a proven track record of offering Integrated product engineering solutions for major global players of diverse industries like Semiconductor, Avionics, Railways, Industrial, IOT (Internet of Things).